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SAE AMS3695/4

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SAE AMS3695/4 83rd Edition, April 1, 1983 Adhesive Film, Epoxy-Base, High Durability For 215 °C (420 °F) Service
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Description / Abstract: Form:

This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.

Application:

Primarily for bonding metal-to-metal or aluminum honeycomb sandwich assemblies for service up to 215°C (420°F). Adhesive thickness 0.005 in. (0.13 mm) is not intended for honeycomb-to-metal bonds and adhesive thickness 0.015 in. (0.38 mm) is not intended for metal-to-metal bonds.