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SAE AMS3739
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SAE AMS3739 Revision A, April 1, 1988
POTTING COMPOUND, EPOXY FILLED 9-1 CTE, 250 HDT
Description / Abstract:
APPLICATION:
Primarily for embedment and encasement of electronic and electrical component assemblies where low thermal expansion and high heat distortion temperature are required.
Primarily for embedment and encasement of electronic and electrical component assemblies where low thermal expansion and high heat distortion temperature are required.
SAE AMS3739 Revision A, April 1, 1988
POTTING COMPOUND, EPOXY FILLED 9-1 CTE, 250 HDT