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SAE ARP1612 Revision A, January 1, 1990
Polyimide Printed Circuit Boards Fabrication of
Description / Abstract:
This document describes the materials, equipment, and processing
techniques utilized in the fabrication of polyimide printed wiring
boards. Included are recommendations for both double-sided and
multilayer boards.
The processes described herein are the result of extensive evaluation and manufacturing experience. These recommendations reflect procedures that have proven effective in producing low-cost and reliable printed wiring boards.
Safety - Hazardous Materials: While the materials , methods, applications, and processes described or referenced in this document may involve the use of hazardous materials, this document does not address the hazards that may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved (see 9 ) .
The processes described herein are the result of extensive evaluation and manufacturing experience. These recommendations reflect procedures that have proven effective in producing low-cost and reliable printed wiring boards.
Safety - Hazardous Materials: While the materials , methods, applications, and processes described or referenced in this document may involve the use of hazardous materials, this document does not address the hazards that may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved (see 9 ) .
SAE ARP1612 Revision A, January 1, 1990
Polyimide Printed Circuit Boards Fabrication of