Description / Abstract:
This document describes the materials, equipment, and processing
techniques utilized in the fabrication of polyimide printed wiring
boards. Included are recommendations for both double-sided and
multilayer boards.
The processes described herein are the result of extensive
evaluation and manufacturing experience. These recommendations
reflect procedures that have proven effective in producing low-cost
and reliable printed wiring boards.
Safety - Hazardous Materials: While the materials ,
methods, applications, and processes described or referenced in
this document may involve the use of hazardous materials, this
document does not address the hazards that may be involved in such
use. It is the sole responsibility of the user to ensure
familiarity with the safe and proper use of any hazardous materials
and to take necessary precautionary measures to ensure the health
and safety of all personnel involved (see 9 ) .