Description / Abstract:
Form:
This specification covers a two-component adhesive compound, an
epoxy resin base and a hardener, in the form of a paste.
Application:
This compound has been used typically for non-structural bonding
of metals and thermosetting plastics, to themselves and to each
other, and as an adhesive for electrical components and devices
operating at not higher than 260 ºC (500 ºF), but usage is not
limited to such applications.
Safety-Hazardous Materials:
While the materials, methods, applications, and processes
described or referenced in this specification may involve the use
of hazardous materials, this specification does not address the
hazards which may be involved in such use. It is the sole
responsibility of the user to ensure familiarity with the safe and
proper use of any hazardous materials and to take necessary
precautionary measures to ensure the health and safety of all
personnel involved.